Optech 1.6T OSFP Flat Top Active DAC Twinax Cable: Ultra-Low Loss Copper for NVIDIA AI Clusters
As AI clusters scale toward 1.6T links, every dB of insertion loss and every source of crosstalk becomes a real limiter—especially in dense switch-to-server or switch-to-switch topologies. Optech’s 1.6T OSFP Flat Top Active Direct Attach Copper (Active DAC) Twinax Cable is built to deliver short-reach, high-bandwidth connectivity with ultra-low insertion loss, strong EMI immunity, and efficient power consumption—ideal for modern NVIDIA-based fabrics.
Designed for high-speed copper interconnects inside AI racks and pods, this active DAC is 100% verified by the original and perfectly compatible with NVIDIA switch devices, helping data center operators deploy with confidence and minimize qualification risk.
Product Overview
Product Type: 1.6T OSFP Flat Top Active DAC Twinax Cable
Use Case: High-density, short-reach copper interconnect for AI/HPC fabrics
Power Consumption: ≤2.5W (maximum)
Electrical Interface: 8×200G PAM4
Key Performance: Ultra-low insertion loss to avoid bandwidth bottlenecks
EMI/Crosstalk Protection: High-shielded copper structure for extreme resistance
Compliance: OSFP MSA
Key Features and Advantages
1) 100% Original-Verified, NVIDIA Switch Compatible
Compatibility issues at 1.6T are expensive—both in downtime and engineering cycles. Optech’s active DAC is 100% verified by the original and perfectly compatible with NVIDIA switch devices, supporting stable high-speed operation in NVIDIA-based AI networking environments.
2) Maximum Power Consumption ≤2.5W
In high-density racks, power and thermals scale quickly. With maximum power consumption of only 2.5W, this active DAC helps maintain predictable rack-level power budgets while supporting 1.6T-class interconnect performance.
3) 8×200G PAM4 Electrical Modulation
The cable supports 8×200G PAM4 electrical modulation, aligning with next-generation OSFP platforms and enabling 1.6T aggregate throughput without forcing a switch to fiber optics for short-reach connections.
4) Ultra-Low Insertion Loss for Bandwidth Integrity
In AI training networks, congestion and retransmissions can appear when physical links become marginal. This active DAC’s ultra-low insertion loss is designed to keep signal integrity strong—helping ensure no bandwidth bottlenecks in high-throughput GPU clusters.
5) High-Shielded Copper Structure for Extreme EMI & Crosstalk Resistance
Dense cabling is a hostile environment: adjacent lanes and neighboring cables can inject noise and degrade margins. Optech uses a high-shielded copper structure to deliver extreme crosstalk resistance and strong EMI immunity, improving stability in crowded switch cages and cable trays.
6) OSFP MSA Compliant for Ecosystem Fit
To streamline deployment and multi-vendor integration, the cable is compliant with OSFP MSA, supporting standard mechanical and electrical expectations for OSFP systems.
Ideal Applications
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NVIDIA-based AI clusters requiring reliable short-reach 1.6T connectivity
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Top-of-rack (ToR) to server NIC interconnects in high-density GPU racks
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Switch-to-switch links inside pods where copper is preferred for cost/latency
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High-bandwidth rack-scale fabrics demanding strong EMI tolerance
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Data centers optimizing for TCO by using copper where fiber isn’t necessary
Why Active DAC for 1.6T in AI Racks?
For many intra-rack and short-reach connections, Active DAC Twinax can be the most practical choice:
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Lower cost per link vs. optical transceivers + fiber for short distances
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Lower latency (short reach copper interconnect profile)
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Simplified deployment (cable-as-a-link; fewer parts to manage)
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Strong performance when insertion loss and EMI are well controlled
Optech’s design specifically targets the two most common causes of short-reach failures at high speeds: loss and interference.
Specification Highlights
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Form Factor: OSFP Flat Top
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Type: Active Direct Attach Copper (Active DAC) Twinax Cable
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Data Rate: 1.6T class
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Electrical Lanes: 8×200G PAM4
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Max Power: ≤2.5W
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Signal Integrity: Ultra-low insertion loss
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Noise Immunity: High-shielded copper for extreme crosstalk/EMI resistance
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Standard: OSFP MSA
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Compatibility: Original-verified, perfectly compatible with NVIDIA switch devices
FAQ
What’s the difference between Active DAC and Passive DAC?
Active DAC includes active circuitry to improve signal conditioning, helping achieve higher speeds and/or longer reach than passive DAC at the same form factor.
Why choose copper over optics at 1.6T?
For short-reach links, copper can reduce total cost and simplify operations—especially when insertion loss and EMI performance are engineered for high-speed stability.
What does “Flat Top OSFP” mean?
“Flat Top” typically refers to the mechanical top profile of the OSFP connector housing, used in certain platform thermal/mechanical designs.
Will it work with NVIDIA switches?
This cable is described as 100% original-verified and perfectly compatible with NVIDIA switch devices, targeting NVIDIA-based AI fabric deployments.
Call to Action
If you’re building or upgrading an AI cluster and need reliable 1.6T OSFP Active DAC Twinax links that maintain bandwidth under real rack conditions, Optech can support qualification with documentation, compatibility guidance, and supply planning.
Contact Optech to request: length options, integration notes for your NVIDIA switch platform, and volume lead times.
